Electronics

One of the advantages of the electron beam welding process lies in its robustness to join materials like aluminum, copper or stainless steels, which are commonly used in semiconductor fabricating equipment and electronic packaging.  The process can be optimized to the specific task by tailoring the shapes of the welds - shallow for sealing purposes to deep and narrow to butt welding of heavy cross sections even in aluminum.

Cooling Plate Welding for Semiconductor Fab Systems

Electron Beam Welding is used to join many components in Semiconductor Fabrication equipment. In this application, gas paths are created by welding covers over milled channels. Weld geometries are typically complex, requiring CNC motion control. The low thermal distortion of electron beam welding is crucial to maintain the dimensions of the part- since all welds are located on one side of the cooling plate. EB welding is also used to attach the inlet/outlet fittings in place.

Description:

Round Plate with
Machined Cooling
Channels

Material(s):

Aluminum or Stainless
Steel

Joint Geometry:

step joint

Weld Depth:

0.200 in.

Heat Sink Welding

Used as a heat sink, this part is manufactured in machined halves which are joined together. In one of the more unique usages of electron beam welding, all the mating surfaces of this heat sink are joined in one 360° pass. Called a "tier weld", the electron beam penetrates each of the individual joints stopping at the inner diameter wall.

Description:

5 in. diameter by 1 in.
high

Material(s):

Stainless Steel

Joint Geometry:

radial circumferential
weld

Weld Depth:

"tier weld" - multiple full
penetration welds

Hermetically Sealed Electronics Package Welding

Rugged metal packaging is used to protect electronic systems operating in demanding environments. The EB welding process allows weld joints to be placed in close proximity to sensitive electronic componentry without causing thermal or electrical damage. Electron beam welding is used for closure welds, creating a hermetically sealed package, which can either remain under vacuum or be backfilled with an inert gas.

Description:

Metal Enclosures for
Electronics

Material(s):

Aluminum 

Joint Geometry:

step joint, T, butt weld

Weld Depth:

< 0.100 in.